How the IPA Vapor Dryer Further Improves Wafer Processing

When silicon wafers are dried after rinsing, the wafer surface has to be free of water marks and contaminating particles.

After hydrofluoric acid removes the silicon oxide layer during the final etching before the next process steps, the silicon wafers are exposed to diffusion and surface contamination. If the wafer surface is not cleaned before undergoing further processing, it will subsequently result in defective or low-quality components. Modutek’s IPA Vapor Dryer delivers clean wafers while reducing operation costs.

In Modutek’s IPA Vapor Dryer, the IPA vapor is introduced into the drying chamber from the top to ensure even distribution, reducing the amount of IPA required and further reducing costs. When the IPA vapor condenses on the wafers, a surface tension gradient develops between the IPA and the remaining water. The water flows off the wafer surfaces, taking the contaminating particles with it. The wafer surface comes out dry as it doesn’t have any more water marks and is now free of particles.

Advantages and benefits of using Modutek’s IPA Vapor Dryer:

  • It lets operators transfer the silicon wafers from the last etch processing station to the dryer chamber without any further movement from the wafers.
  • It is a gentler alternative to heat drying or rotating the wafers to spin off excess water.
  • IPA dryer cabinets are a compact 30 inches wide and made of polypropylene.
  • It uses SolidWorks Simulation Professional and SolidWorks Flow Simulation software to calculate process flow characteristics and reduces the required drying time.
  • It can be customized and be designed to fit into the customer’s existing wet process equipment lines and meet customer requirements.

If you would like to learn more about the topic, read our latest article, “How the IPA Vapor Dryer Further Improves Wafer Processing.” You may also set up a free consultation to discuss your particular needs by emailing or by calling 866-803-1533.

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